Camino Buff Credencial

18,95

In stock

SKU: BUFFC Category:

Description

Camino Buff Credencial

The Camino Buff Credencial shows a beautiful pattern of stamps and looks just like your own pilgrim credential will look like over time.

The CoolNet UV+® is Buff’s newest recycled fabric it’s moisture management properties pull sweat away from your skin and into the evaporative cooling fabric design so you stay cool.

The fabric is seamless and stretchy. It’s an essential accessory when you are undertaking outdoor activities in warm and hot weather conditions.
The High UV Protected Camino Buff with the new CoolNet UV+® was designed to cool you down by vaporizing moisture and removing body heat so you stay cool, dry and comfortable.
Ultra lightweight (up to 20% less than the original Buff) and breathing microfiber fabric is very comfortable and has no irritating seams or hems.

The Camino Buff Credencial can be worn as neckerchief, headband, wristband, mask, hairband, balaclava, scarf, scrunchie, saharaine, pirate cap, beanie or bandana! Take a look at the video to see how it’s done, it’s amazing!

The Buff is machine washable and will keep its colors and elastic properties. You won’t need to iron it! The Buff has been treated with Polygiëne®. The silver ions prevent bacteria building up in the fabric, which will keep the Buff odor-free.

  • cooling effect (you stay cool, dry and comfortable)
  • 4-way ultra stretch weave and 100% seamless design
  • machine washable and non iron.
  • will not lose its elasticity and colors.
  • UPF 50+ (95% UV protection).
  • breathable and moist-regulating.
  • fabric stays clean and odor-free thanks to Polygiëne®.
  • ultra Light; 37 g.
  • dimensions: 51 x 24,5 cm (designed to fit adult head circumference 53 – 62 cm.
  • thermal comfort: warm – hot.
  • 95% Recycled

This post is also available in: Dutch

Additional information

Weight 37 g
Dimensions 51 × 24.5 cm

Reviews

There are no reviews yet.

Be the first to review “Camino Buff Credencial”

Your email address will not be published. Required fields are marked *